Synthetic diamond powder at the micron and sub-micron sizes.
The patented Hyperion Diamond powder has a modified surface that has many tiny micro-points that significantly reduce the workpiece's surface roughness.
As the electronics industry develops and demand for silicon carbide wafers rises, manufacturing efficiency and throughput are critical. Beyond slurries, hyperion diamond powder is now being used for grinding ultra-fine crystals. It has outstanding surface finish capabilities and a high rate of material removal.
With sizes ranging from 0.25µ to 100µ, Hyperion Materials & Technologies offers a full range of Hyperion Diamond solutions in micron and submicron sizes. To maximize performance for particular workpieces.
Hyperion provides a worldwide network of sales, customer service, and technical support professionals to assist clients at every stage for added convenience. Through its R&D facility in Worthington, Ohio, Hyperion offers testing, fabrication, and application development support as part of its customer service offerings.
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